Ausgabe 07/2010

Latest News / Exhibitions

Polymer Electronics - See and be Seen 

Design

Why should Printed Circuit Board Specialists Change - and How Can They Do So? 
(R. Evans) 
 (Größe: 523 KB)

InfoCom 2010: Touch Screens and LED Projectors on the Rise 

Elpida on Track for Giga-Rated DRAMs 

Sony Shows Roll-up OLED Colour Display 

Zuken E3 Functional Design - for more Integration in the Design Process 

Bauelemente

ZVEI - Optimism in the Electromechanical Components Sector 

Colourful Housings from Suyin 

Transparent Electrically-Conductive Oxides - a Key Technology, not Just in Photovoltaics 

Gold Remains Irreplaceable 

PCIM Europe 2010: Optimising Performance for Better Energy Efficiency 

ASIC for Measurement of the Smallest Capacitances 

Printed Circuit Board Technologies

Straight to the Point: Shifts in Global Power Often Go Unnoticed 
(H.J. Friedrichkeit) 

From Lab to Fab - Organic and Printed Electronics on the Way to Mass-Production 
 (Größe: 843 KB)

Cost-Effective Production Processes and Homogeneous Illumination for OLEDs Thanks to Micro-Scale Tracks 

China en Route to the Premier League in Electronics Production? 

Packaging / Hybrid Technology

Application Trends and Markets for Embedding Technologies as Compared with Standard HDI Technology 
(Markus Riester) 
 (Größe: 571 KB)

Coatings for Solar Technology and Electronics with a Future 

Laser-Beam Glass Welding for Robust Packaging of Electronic Components with Long-term Stability 

Research & Technology

Light Source and Illuminated Eyecatchers on a Typical Electronic Circuit Board 
(K. Schmieder et al) 
 (Größe: 119 KB)

Transparent conductive electrodes on Plastic Film - a Research View 

Organic Electronics Saxony e.V -Europe`s Leading Organic Cluster - from Research to Product 

Board Assembly Technologies

Build-up and Interconnection Technology together with Reliability from Low-Temperature Solders Based on SnBi 
(J. Trodler et al) 
 (Größe: 899 KB)

Defluxing Evolution 
(B. und E. Kanegsberg) 

For the Fifth Time, Wir-gehen-in-die-Tiefe - Success is the Reward for a Special Concept 

Viscom Technology Forum and Customer Meeting 2010: Excellent Resonance and Forecasts 

An Informative Mydata User Meeting 2010 

Martin Sets Out with New People and New Products 

2nd TQ Academy Day - The Value of EMS Know-How Made Clear 

3rd Assembly Testing Technology Day in Jena 

Strategies for Printed Circuit Board Verification and Troubleshooting in Production of Lead-free Assemblies 

JUKI meets Friends in Nuremberg 

A Good Start for IPTE FA 

Three Turn into One: modEMS from straschu 

Flexible Component Mounting to the Highest Specifications 

Great Interest in SMD Stencils and Services 

Forum

Online-Tool for Eco-design 

Illuminated Copy-Protection 

Daiwa House Industries Create a Green Autonomous Supermarket 

Fujitsu: New Eco-Keyboard using Plant-derived Raw Materials for Green IT 

Association News
(All Association News are only in German)

3-D MID-Informationen

DVS-Mitteilungen

FED-Informationen

VdL-Nachrichten

ZVEI-Mitteilungen

IMAPS-Mitteilungen